Creyr Products and Services

Process Refinement and Implementation

We can help you plan and execute a wide variety of processes and systems in your organization as well as educate your staff for sustaining performance. Creyr Innovation is built on the principle of using our internal knowledge to join the best product and service providers in the industry in a unique way for each of our customers. We work daily within an extensive network of experts, and can coordinate the right resources to support you in your own innovations.
Process expertise includes but is not limited to:

Leading-Edge Packaging & Assembly Technologies
Process Changes due to Legislative Driectives (i.e. RoHS)
Materials Selection & Qualification

Contributing associates have decades of real-life, hands-on experience in many manufacturing technologies and proven processes. Each associate takes pride in maintaining current knowledge in his or her respective field.

Manufacturing Systems/Process Assessment

Offered by Unovis Advanced Process Laboratory

Established methods and processes for measurement, data accumulation, and statistical analysis are used to identify and improve key functions to optimize productivity, yield, and product reliability.

Formal Assessment of Systems & Processes
Identification of Opportunities for Improvement
Improvement Implementation
Assessment of Results

Laboratory and Testing Services

Offered by Unovis Advanced Process Laboratory

Root Cause Failure Analysis
Specimen Analysis
Reliability Testing – Including Environmental Exposure
Development of Product, Processes, & Specifications
Prototyping
Certifications
Focused Consortia and Applied Research

Offered by Compliance Management Group

Regulatory Testing
Compliance Certification Services
Engineering Support for Compliance Certification
Electromagnetic & Emissions Compliance, Product Safety, Automotive, Telecom/Wireless, Mechanical, Environmental & More.

Offered by Kyzen Corporation

Cleanliness Benchmarking
Cleaning Process Development & Testing

Process Assembly Materials

Offered by Indium Corporation

Over 200 Alloys
Solder Paste, Preforms, Spheres, Foil, Ribbon, and Wire
Solder Flux
Ingot & Shot
Underfills, including no-flow reworkable underfill
Thermal Interface Materials
Industry-leading Pb-free Assembly Materials

Stencils & Screens for Precision Materials Deposition

Offered by MicroScreen

Many Options Available
Next Day Delivery Standard for Stencils

Product Identification Solutions

Offered by Nortec Inc.

Labels: including Auto-Apply, Harsh Environment, Security & Tamper-Proof
Thermal Transfer Ribbons, Label Printers, Software & Feeders
Total product identification management assistance and implementation

Precision Cleaning Solutions

Offered by Kyzen Corporation.

Full cleaning process implementation
Engineered Cleaning Fluids for: electronic assembly, microelectronics and semiconductor manufacturing, optical and precision glass, and metal finishing
Contract Cleaning Services
Cleaning Process Accessories

Odd Form & Multi-Process Assembly Equipment

Offered by Unovis Solutions.

Multi-Process Assembly Cells – flexible automation of traditionally manual, end-of-line assembly processes. Multiple operations can be performed in a single cell, including dispensing, vision inspection, screw driving, pick and place, bar code reading, labeling, and many other operations.
Servo-Gripper Assembly Cells – Efficient automation of final product assembly and odd form assembly. Assemble virtually any non-standard device including connectors, transformers, shielding, and more.
Single Process Assembly Cells – Economical, single-process final assembly providing the exact amount of functionality to meet specific requirements. A standard interface and large portfolio of existing tool modules enable a wide range of applications on a common platform.

Semiconductor Assembly Equipment

Offered by Unovis Solutions.

Unovis Advanced Semiconductor Assembly Cells allow for a wide variety of process steps to be performed on the same platform-based cell. Capabilities can include, but are not limited to:

Dispense
High-Accuracy Die & Component Placement
Thin Film Flux Application – Gang Dip
High-Accuracy Vision Inspection
Low Force Placement
Package Stacking
Direct Die and Wafer Feeding
Standard SMT Component Feeding
Multi-Head and Multi-Beam configurations
Enhanced Software Capability
SMEMA Communications Interface Standard

The flexibility of these assembly cells makes them ideal for applications at the convergence of Semiconductor Assembly and SMT, such as System-In-Package, and Board-level Package Stacking. Options for your assembly cell can be updated as your product mix and requirements change, without the need to invest in new equipment.