Unovis Advanced Process Laboratory Consortium Convened in February
February 27 and 28, 2008, representatives of the the Area Array Consortium will convened to review progress of 2007 research and discuss plans for 2008. The consortium is world renowned, providing research & technology excellence for over 16 years. Members from around the world meet three times per year to discuss new findings and to receive guides and protocols for their immediate application. If your company is considering membership, please contact us. You may be eligible to attend.

Highlights of recent meetings included the following presentations by Laboratory Staff, Industry Consortium Members, and University Partners:
- QFN Process Development & Reliability
- Behavior of Bubbles in Liquids - Study of Void Formation & Behavior.
- Voiding in Paste-only Solder Deposits - Comparison of Paste Chemistry Performance
- Component Underfills & Compatibility with Fluxes
- Package on Package (PoP) Assembly & Reliability - Including New Underfill Studies
- Voiding in Cu3Sn
- Cu Electroplating and Voiding in CuSn
- Effects of Microstructure on Lead Free Solder Joint Reliability
- Lead Free Solder Joint Fatigue Study
- Effect of Thermal Cycling Parameters - Pb-Free
- Challenges in Thermal Cycling of Lead Free
- FCBGA Thermal Cycling Project
- Lead Free HASL Project Update
- Pad CrateringUpdate
- Missing Ball And Other Brittle Failures on Ni/Au
- Effects of Au on Brittle Failures in Assemblies on Electrolytic Ni/Au
- Investigations of Brittle Failure of IMCs on ENIG
- Underfill for Lead Free Flip Chips
- Reballing Lead Free Components with SnPb
- 2008 Plans
If you are facing new technology challenges or preparing for future designs and are not yet familiar with the Consortium, we welcome you to contact Creyr or the Unovis Advanced Process Laboratory to discuss how membership could benefit your current projects and the future of your organization. For more information please click here to visit the Unovis page on our web site.
Kyzen Premiers AQUANOX A4625B Aqueous Blend Batch Cleaner
Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, introduced AQUANOX A4625B at the APEX 2007 exhibition and conference in Los Angeles.
AQUANOX A4625B is an MEA-free aqueous blend specifically designed for optimum effectiveness in batch washers. This easy-to-use cleaning material will remove flux residues and contaminants associated with most electronics assembly processes while being environmentally friendly.
A4625B is used at low concentrations for optimum cleaning efficiency without damaging delicate substrates.
February 20, 2007
Kyzen Wins 2007 Service Excellence Award
Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it has been awarded a 2007 Circuits Assembly Service Excellence Award in the category of Electronics Suppliers — Cleaning Materials for its outstanding customer ratings, as judged by Kyzen’s own customers.
Circuits Assembly Editor-in-Chief Mike Buetow presented the award to Tom Forsythe, vice president, during a Monday, February 19, 2007 reception that took place in Los Angeles, CA before the start of APEX.
The 15th annual Service Excellence Awards present awards to EMS providers, and equipment and software suppliers. The awards honor companies in the manufacturing industry that exceed expectations in customer service.
For the awards in the Equipment Suppliers and Software Suppliers categories, companies are rated on a scale of 1 (poor) to 5 (superior) in five service categories: dependability; ease of use; responsiveness; technology; and value for price.
February 19, 2007
Kyzen’s Lonox Cleaning Fluids Approved by MicroScreen
Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces their products, Lonox L5611 and L5314 have been approved by leading stencil provider, MicroScreen.
LONOX® L5611 is an aqueous blend designed for optimum effectiveness on removing flux, solder paste and uncured adhesives from stencils and misprints. Easy to use, LONOX® L5611 is effective at ambient temperature to provide an economical cleaning solution. This product is also compatible with most standard stencil cleaning equipment.
LONOX® L5314 is a water-soluble concentrated cleaning liquid designed for cleaning stencils and wave solder pallets. LONOX® L5314 is extremely effective on raw solder paste, as well as on fluxes built up on wave solder pallets, yet mild enough on pallet hardware for repeated wash cycles. This product features low use cost and is low VOC and RoHS compliant.
MicroScreen is a leading supplier of stencils to the microelectronics industry. For the past 25 years, the company has provided the quality and service necessary for today’s advancing technology. E-mail info@microscreen.org Web site: www.microscreen.org
February 16, 2007








