Advanced Process Laboratory Hosts AREA Consortium Meeting
Universal Instruments’ Advanced Process Lab hosted the second of three 2010 meetings of the Advanced Research in Electronics Assembly (AREA) Consortium on June 16 & 17, in Owego, NY. Members traveled from around the world to participate in the two-day event & more will participate in web casts of the presentations in subsequent weeks.

Attending companies included industry leaders such as Alcatel-Lucent, Asymtek, BAE, Boston Scientific, Brocade, Celestica, Curtiss Wright, Dell, Ericsson, Harris, IBM, Indium, Lord Corporation, MIT Lincoln Labs, Motorola, Multek, Northrop Grumman, Plexus, Qualcomm, Rockwell Automation, Sun, Texas Instruments, and Textron.
2010 Topics Include:
- PCB Damage
- Pad Cratering
- Solder Pad Finish Issues (Sporadic Joint Fragility)
- Thermal Cycling Data and Assessment of Life
- Drop, Vibration & Cyclic Bending
- Acceleration of Aging
- Combined Loading
- Whiskers & Conformal Coatings
- Thermal Interface Assembly & Reliability
- Assembly & Rework/Repair
- Component Underfilling & Edge/Corner Bonding
If you are facing new technology challenges or preparing for future designs, we welcome you to contact Creyr or the Universal Instruments Advanced Process Laboratory to discuss how AREA Consortium membership could significantly reduce your technology research costs, benefit your current projects and the future of your organization. For more information please click here to visit the Universal page on our web site.
June, 2009
Indium Corporation’s Heat-Spring® Wins Innova Award for Best Technology
Indium Corporation
has won the Innova Award for Best Technology for its Heat-Spring®
metallic thermal interface material (TIM).
Heat-Spring is a clean, high-performance thermal solution for the increasing demands of high brightness LEDs. It is a compressible metal foil with proven performance in such demanding environments as electronics, aerospace, and power devices.
The compressible TIM provides low thermal resistance as a result of its high thermal conductivity (86W/m-K) and its ability to conform intimately to interface surfaces.
Unlike other thermal interface materials, such as thermal grease that bakes out, dries out, or pumps out during use, the thermal resistance of the Heat-Spring continues to improve with time and power cycling.
According to Jordan Ross, Market Manager for Thermal Materials, "Indium Corporation is honored to be recognized with the Innova Award for our patented Heat-Spring product. With its patented compressible interface design, Heat-Spring provides optimized surface contact, superior thermal conductivity, and enhanced heat flow."
Sponsored by LED Journal, the Innova Awards feature leading companies within the LED market which have shown, through their products and services, the most innovative and advanced technology breakthroughs in LEDs. The award is designed to recognize companies each year for industry leadership, product development excellence, best new technology, and outstanding LED applications, which will eventually lead to the widespread adoption of LED technology in the marketplace.
May 2010
Joe Belmonte Joins Creyr Innovation
We are very pleased to announce Joe Belmonte has become part of our team at Creyr Innovation. Joe has joined our team to
provide sales & customer support in New England (CT, MA, ME, NH, RI, & VT) for all Creyr Innovation’s principals. Joe brings a wealth
of knowledge and experience, consistent with our goal of being the premier Technology Solutions Provider & Supplier
Representative for the electronics industry.
Joe has been a process engineer and process engineering manager in electronics manufacturing for over 30 years. His responsibilities have included managing advanced process development projects such as Pb-free Process Development, miniature component assembly, developing and conducting process training programs, and working with customers on quality, cycle time, and cost improvement projects.
Positions held include:
- Manger of Advanced Manufacturing Engineering at Bose Corporation in Framingham, MA
- Staff Consultant and Engineering Project Manager at Cookson Performance Solutions in Foxboro, MA
- Application Engineering Manager and Project Manager at Speedline Technologies in Franklin, MA
- Process-engineering manager at Motorola ISG in Massachusetts
Joe has been a member of the Surface Mount Technology Association (SMTA) since 1985 and is currently a member of the Board of Directors. He has written papers for many trade magazines, trade shows, and has spoken at technical conferences and professional society meetings worldwide. Joe is also a consultant for ITM Consulting.
Joe holds an Associate Degree in Mechanical Design from Wentworth Institute and a Bachelor of Science Degree in Operations Technology from Northeastern University in Boston Massachusetts.
January, 2010
MicroSreen Offers Screens with High Tension Mesh
South Bend, IN. MicroScreen announces the manufacture of screens with new HT stainless steel mesh.
Produced from specially developed wires and woven on state-of-the-art looms, the HT mesh is a high-tension mesh
capable of achieving tension values much higher than traditional meshes.
The higher tension on the screen allows the use of a lower off-contact and less squeegee pressure. Less off contact and quicker snap off of the ink behind the squeegee improves print quality and contributed to increased cell efficiency.
Screens fabricated with HT mesh show improvements in the separation of the ink from the mesh. Ink clears the mesh opening much easier producing better print consistency and image quality, particularly on fine lines.
MicroScreen is a manufacturer of screens for solar cells, membrane switch, large format and thick film printing, as well as laser cut and electroformed stencils.
November, 2010






